Temperature Measurement for Electronic Testing Applications
Temperature monitoring of integrated circuit die, printed circuit boards, and discrete components
Electronic component testing with common contact based temperature measurement methods, such as thermocouples (TC) and Resistive Thermal Devices, presents several challenges.
First, obtaining a good thermal connection to the object under test can be difficult due to the rigidity of the metal contact junction, especially if the components are of varying shapes. The required physical contact can also potentially damage sensitive components. Second, the high thermal conduction of metallic leadscan cause slow drifts in temperature until the system comes to thermal equilibrium. Third, if the component is under power, there is the risk of a potential short circuit. Finally, TCs and RTDs have a finite life due to metal fatigue, repeated bending and corrosion over time.
LumaSense offers two technologies to address these issues and to provide a robust temperature measurement system:
Infrared thermal imaging MC320
- Non-contact monitoring. Measures the thermal radiation emission from components and eliminates all issues with thermal and electrical conduction, physical contact, and lasts longer.
- Thermal profiles with excellent special resolution. Provides stunning full color 2-D visual images of entire components, highlighting thermal gradients and device-to-device comparison. The 75,000+ pixels and micro lens option allow for a resolution of 200μm.
- Fast response. Offers 60 Hz operation for monitoring transient and in rush conditions.
- Professional Software package. Provides trending for statistical process control (SPC), custom alarm and region definitions, image processing, and export functions.
Fiber Optic Thermometry: Models 812, 822, and FOT Lab Kit
- Phosphor decay technique. Optical temperature measurement system utilizing the temperature dependent decay of ceramic phosphor sensors, immune to all EMI sources.
- Flexible fiber optic probes. Fiber optic probes with soft silicone tips allow excellent thermal contact to devices being tested. The all glass and plastic construction minimizes thermal heat sink risk and prevents electrical conductivity. Offers spatial resolution to 500 μm.
- Fast and Accurate. Up to 10 Hz operation with accuracy as good as 0.1 °C. In-situ calibration routine and no drift to ensure accurate performance.
- Modular construction. Simple snap connectors with robust, but replaceable, probe tips that can be easily integrated into test stations and used to eliminate metal fatigue issues. Flexible fiber optic extensions and compact electronics modules provide a complete solution.
- Realize fast, flexible, and accurate temperature measurement of electronics for device characterization, test fixtures, and failure analysis studies.
- Eliminate issues with heat conduction and electrical conduction by using either non-contact infrared thermography or improved contact fiber optic temperature monitors.
- Reduce downtime and increase efficiency with robust sensors that minimize the need for calibration and eliminate or reduce the frequency of sensor replacement.
- Gain insight into your devices thermal signature with complete 2-D thermal profiles and improved spacial resolution.